Loughborough University is a top-ten rated university in England for research intensity (REF2014) and an outstanding 66% of the work of Loughborough’s academic staff who were eligible to be submitted to the REF was judged as ‘world-leading’ or ‘internationally excellent’, compared to a national average figure of 43%. In choosing Loughborough for your research, you’ll work alongside academics who are leaders in their field. You will benefit from comprehensive support and guidance from our Doctoral College, including tailored careers advice, to help you succeed in your research and future career. Heterogeneous integration of power devices refers to the assembly of separately manufactured power semiconductors, passive components and control elements into a single package, i.e. System in Package (SiP) that, in the aggregate, provides increased functionality, enhanced reliability and reduced cost. The integration of the next generation wide-band gap (WBG) power devices has, nevertheless, been bottlenecked by prevailing manufacturing technologies, which are unlikely to offer a cost-effective way of implementing the necessary 3D structures needed to contain the electromagnetic interference (EMI), address the thermal integration issues and offer a more robust and reliable packaging solution. This PhD project will focus on the development of novel structural embedding methodology and 3D multi-material architecture, using various processing methods such as subtractive lithography, additive manufacturing, patterned deposition (e.g. electrolytic and electroless plating) and precision micro-machining, and with emphasis on the thermal and electrical reliability of the integration system. Successful candidates will join an interdisciplinary team with substantial industrial exposure and academic collaborations in the UK and worldwide, as such they will be able to continue their career in this exiting field delivering future high value added hybrid electronics.